ThermaxTech XFlux-GA Thermal Compound



TherMax Tech, Inc. is the premier manufacturer of high-performance thermal compounds for computer and high-power electronics. They have developed a series of high-performance thermal greases, XtFlux-KA, XrFlux-KAII, and XfFlux-GA. The company was started in October of 2005 and based in Texas.

Thermal Compound Comparison
TherMaxTech xFlux-GA Arctic Silver 5 Arctic Silver Ceramique
Thermal Resistance (cm2/W) 0.067 0.0045 0.007
Thermal Conductance (W/m2) ~200,000 350,000 200,000
Density (g/ml) 3.40 ? ?
Viscocity 750 ? ?
Thermal Limits (Celcius) -50 to 200 -150 to 180 -50 to 180
Base secret forumula of high-purity particles (one of them copper) in silicone oil 99.99% pure silver in 88% solution of non-conductive filler. Aluminum oxide, boron nitride and zinc oxide in polysynthetic oil

The TherMax Tech XFlux-GA compound is packaged in a clear plastic bag that is sealed with a cardboard label at the top. 3.5 grams of compound is contained in a translucent medical syringe with a clear reusable cap. The yellow label on the syringe provides the product name, company website and “Keep Away From Children” warning. The cardboard label stapled onto the bag mirrors the syringe’s information.

Being very curious about this unique product, we opened the bag and tested the brown compound. It feels very greasy and sticky, and does not wipe off easily. Wiping the product off with a dry paper towel left our fingers stained brown, but came off easily with soap and water. The brown color leads us to conclude that the main ingredient in this solution is copper. TherMax Tech acknowledged that copper was one of the ingredients, but would not provide more clues to its composition. The compound is thick, but not as thick as generic compound, almost feeling like oil-based paint. The brown compound is very sticky, like printer’s ink, and adheres very well to metal.

To test the thermal grease we used 2 different heatsinks: a generic Intel OEM (a copper core surrounded by aluminum and 80mm fan) and the good-performing Zalman CNPS-Cu Flower heatsink (all copper heatsink with 92mm fan). Thermal grease was applied to our Pentium-4 and spread to coat the entire surface. Some of the excess from the processor was rubbed into the base of the heatsink to prime it, then placed on top of the processor and secured. Load was tested using 3dMark 2005 and the highest temperature recorded from the motherboard’s thermal sensor. After the test, the heatsink was uninstalled and compound removed with rubbing alcohol. The heatsink and compound results can be found in the tables and charts below.

Our test system
  • Pentium-4 2.8Ghz 800FSB with HT
  • OEM Intel Aluminum heatsink with copper base
  • Zalman CNPS-Cu flower heatsink
  • Asus P4P800-E motherboard (intel i865 chipset)
  • Asus GeForce 6800GT AGP
  • 1GB DDR Dram
  • Windows XP Professional SP2
  • 3dMark 2005
Thermal Compound Comparison
heatsink Generic Compound Arctic Silver 5 Arctic Silver Ceramique TherMax Xflux-GA
Zalman CNPS-Cu (idle) 92 89 82 82
Zalman CNPS-Cu (load) 109 106 95 95
Intel OEM (idle) 95 91 90 91
Intel OEM (load) 135 126 123 123

The TherMax Tech XFlux-GA heatsink compound performs better than generic white silicone compound and Artic Silver 5. The statistics of the GA compound is similar to Arctic Silver Ceramique and this test proves performance to be similar as well. Nearly all the compounds held roughly the same temperature at idle, but the thermal efficiency of the compounds is revealed at full processor load. The XFlux-GA performs as well as the previous King of Thermal Compound!