Evercool LGA775 Copperman Heatsink Review


A closer look

I have always heard the myth of cooking an egg on the sidewalk during a hot summer day. Some people have even tried this, trying to prove or debunk the myth. If a sidewalk can reach temperatures hot enough to fry an egg, imagine the confections we could create using today’s high-end processor. You might be able to fry a tiny omlette or bake a 1/4″ brownie – there’s an idea ready to pop: create a heatsink with a teflon inner easy-bake oven! Getting back to the point: today’s processors generate an enormous amount of heat and hefty copper heatsinks are the only real answer for air cooling these thermal marvels.

There are not alot of heatsinks for the Pentium 4 LGA775, as the mounting method is very specific. Any 775 heatsink must be attached to a metal brace on the underside of the motherboard. This mechanism prevents the motherboard from warping with tension, and ensures that relatively flimsy plastic pieces will not break. This ensures a high-quality and sturdy mounting method. Evercool has manufactured a new LGA775 heatsink called the CopperMan, which is constructed completely of copper and looks to be a high-performance contender for Pentium 4 LGA-775 processors.

The Evercool Copper Man heatsink is housed in a clear plastic blister-pack, which requires scissors and adult supervision to open. Inside the package is the heatsink itself (the fan, brace, mounting screws, and heatsink are come assembled together), and a small pack of while thermal paste.

  • Dimensions: 92 x 92 x 72 mm
  • DC Fan Size: 92 x 92 x 25 mm
  • Material: Copper base + Copper Stacked Fins
  • Fan Bearing type : ‘Ever lubricated’ bearing (long life bearing)
  • Fan rotation speed: 2600 RPM
  • Noise: < 30 dBA
  • Max Air flow: 50 CFM
  • Thermal Resistance 0.23
  • Weight: 613g

  • 100% pure copper heat sink using stack fin technology
  • Attached 80mm blue LED fan
  • Exclusive clip kit, which prevents motherboard warping
  • High-performance thermal resistance 0.23
  • All P4-LGA775 motherboards
  • No socket-478 motherboards

The fin design is similar to Zalman’s CNPS line of heatsinks, but the fins are soldered to a solid copper core. Zalman’s base is formed by placing lots of shaved copper layers together, whereas this Evercool heatsink uses a different implementation: solder shaved copper fins directly to a thick copper base. Both methods perform very well, as a welded or soldered joint performs about as well as a solid sheet. There is a basic formula to determine a copper heatsink’s potential: weight, surface area, and airflow. Heatsinks with thick fins do not have as much surface area as a sink with the same weight with razer-thin fins. Air can blow over more surface area, removing more radiated heat.

The thin fins of the CopperMan already promise high-performance heat removal. The fins are positioned in such a way as to direct residual airflow out onto the motherboard components surrounding the heatsink, providing auxilary motherboard cooling.