Wintec Amp-X PC5400 DDR2 Review

wintec-amp-x-pc5400

Introduction


Wintec Industries was founded in 1988 and is one of the world’s leading original equipment manufacturers (OEM), of memory modules, and a top supply-chain service supplier for value-added resellers (VARs). They currently have trade association memberships in such organizations as JEDEC (Joint Electron Device Engineering Council), EIA (Electronics Industries Alliances), CFA (Compact Flash Association), SD Card Association, MMMCA (Multi Media Card Association) and Bluetooth SIG. They recently entered the “extreme” market of memory to cater to those of us who want the most bandwidth and high overclocks.

Although AMD currently does not offer a DDR2 platform and probably won’t for sometime, Intel is leading the way. With all of Intel’s new processors using DDR2 the need for high quality DDR2 is becoming more of a concern for overclockers. Most of the major manufacturers have already rolled out their line of DDR2 and are continuing to improve upon their technology.

What are the major differences between DDR1 and DDR2?
Current DDR uses a 2-bit prefetch while DDR2 implements a 4-bit prefetch, prefetching is gathering data before it is needed. This basically means that every bus cycle 4 bits of data will be transmitted instead of 2. Of course this probably leads you to wondering why the overall bandwidth isn’t doubled as well. The simplest answer I can give is because information is only requested half as often. DDR2 also utilizes a FBGA (Fine Ball Grid Array) while DDR uses a TSOP-II (Thin Small-Outline Package). The FBGA uses a find pitch ball arrangement on the underside of the package, where the TSOP has leads protruding from the sides of the package. Because the contact point of the FBGA is on the bottom of the package, the package can be made smaller than the TSOP.

Features New To DDR2
There are also a few new features for DDR 2 that are good improvements over current DDR. With original DDR excess signal noise is eliminated using terminating resistors that are built into the motherboard. In DDR2, resistors are still used eliminate the excess noise, however these resistors are built into each of the memory chips on the module which keeps them closer to the source of the noise. This is intended to reduce interference within the chip. Posted CAS and additive latency are two new technologies that work together to prevent data collisions within the memory as well as better utilizing the data transferring more read/write within each clock cycle. Off-chip driver calibration (OCD) is another new technology which provides the option of tightening the variance of the pull-up and pull-down output driver at 18 ohms nominal. This increases the signal integrity and the system timing margin. The table below is a summary of the major differences between DDR and DDR2.

DDR
DDR2
Data Bus
64 bits
64 bits
Data Rate
200/266/333/400 Mbps
400/533/667 Mbps
Bus Frequency
100/133/166/200 MHz
200/266/333 MHz
DRAM Frequency
100/133/166/200 MHz
100/133/166 MHz
Package Type
TSOP-II
FGBA
Densities
256 MB, 512 MB, 1 GB
256 MB, 512 MB, 1 GB
Voltage
2.5 volts
1.8 volts
Prefetch Size
2 bit
4 bit
Burst Length
2/4/8
4/8
CAS Latency
1.5, 2, 2.5
3+, 4, 5
Write Latency
1T
Read Latency-1
Packaging
TSOP (II), TBGA
FBGA

 


Specifications
Capacity: 1GB Kit
Number of Modules: 2 x 512MB
Bandwidth: PC2-5400
Configuration: 64M x 64
CL: CL 4-4-4-10
Organization: 64M x 8
ECC/REG: Non-ECC
PCB Height: 1.181″
Rank: 1 per module
Chip Count: 8 per module
Pin Count: 240-Pin
Module Type: DIMM
Voltage: 1.8v
Profile: Normal
Warranty: Lifetime

This memory is a 1GB (2x512MB) kit of dual-channel, 1-rank DDR2 that operates at 675MHz. It has been Tested to run at the low latency timings of 4-4-4-10 at 1.8v. The packaging is very simple and similar to most other memory on the market today.

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The memory is covered by a black aluminum heatspreader to dissipate heat from the components. This memory uses Micron DDR2 chips which are typically good when it comes to overclocking. Instead of using 16x32MB memory chips Wintec decided to use 8x64MB chips which means one side of the memory is empty. I really like the overall look of the memory since I am a big fan of black and white.

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